Traduction et analyse de mots par intelligence artificielle ChatGPT
Sur cette page, vous pouvez obtenir une analyse détaillée d'un mot ou d'une phrase, réalisée à l'aide de la meilleure technologie d'intelligence artificielle à ce jour:
- comment le mot est utilisé
- fréquence d'utilisation
- il est utilisé plus souvent dans le discours oral ou écrit
- options de traduction de mots
- exemples d'utilisation (plusieurs phrases avec traduction)
- étymologie
Qu'est-ce (qui) est EBGA - définition
![wire bond]] BGA package; this package has an Nvidia [[GeForce 256]] GPU](https://commons.wikimedia.org/wiki/Special:FilePath/NVIDIA@220nm@Fixed-pipline@NV10@GeForce 256@T5A3202220008 S1 Taiwan A DSC01376 (29588383793).jpg?width=200 "wire bond]] BGA package; this package has an Nvidia [[GeForce 256]] GPU")
Wikipédia
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
BGAs were introduced in the 1990s and became popular by 2001.
Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens.
